Spiral orbital shear apparatus

B - Operations – Transporting – 21 – F

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164/48

B21F 11/00 (2006.01) B26D 3/16 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1248010

ABSTRACT OF THE DISCLOSURE During the assembly of electronic components on circuit boards, the problems of ductile smear cusps produced on wire ends by traditional scissor-type shearing are addressed by a spiral orbital shear apparatus. This apparatus includes a first fixed plate having an array of apertures and a second plate also having the array of apertures. The first and second plates have abutting surfaces. A first eccentric drive member is connected to rotate at a first rate in a first direction. A second eccentric drive member is connected to the second plate and rotates with the first eccentric drive member. The second drive member is also rotated at a second rate in the first direction independently of the rotation of the first drive member.

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