Spiral wound heat sink and method

Details Spiral wound heat sink and method Spiral wound heat sink and method

H - Electricity

01

L

356/113

H01L 23/46 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1255811

ABSTRACT OF THE DISCLOSURE In a heat sink for semiconductor elements and the like, a pipe made of a heat-conductive material such as copper, aluminum and the like is bent at a middle portion thereof and wound such that a forward flow passage and a return flow passage for a liquid coolant are both formed into a spiral shape with the bent portion held at the center of the spiral.

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