Split wave compensation for open stubs

H - Electricity – 05 – K

Patent

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Details

H05K 1/00 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2690339

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Conformément à un premier mode de réalisation, la présente invention porte sur un substrat de circuit comprenant une première surface; une seconde surface; un premier trou d'interconnexion ayant une première extrémité proche de ladite première surface et une seconde extrémité proche de ladite seconde surface; un second trou d'interconnexion ayant une première extrémité proche de ladite première surface et une seconde extrémité proche de ladite seconde surface; un premier élément conducteur couplant électriquement ladite première extrémité dudit premier trou d'interconnexion et ladite première extrémité dudit second trou d'interconnexion; un second élément conducteur couplant électriquement ladite seconde extrémité dudit premier trou d'interconnexion et ladite seconde extrémité dudit second trou d'interconnexion; une ligne de signal d'entrée couplée audit premier trou d'interconnexion; et une ligne de signal émis couplée audit second trou d'interconnexion.

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