H - Electricity – 01 – J
Patent
H - Electricity
01
J
H01J 37/34 (2006.01) C03C 17/06 (2006.01) C03C 17/09 (2006.01) C03C 17/22 (2006.01) C03C 17/245 (2006.01) C03C 17/34 (2006.01) C03C 17/36 (2006.01) C03C 17/40 (2006.01) C23C 4/12 (2006.01) C23C 14/34 (2006.01) C23C 14/35 (2006.01) E06B 3/67 (2006.01)
Patent
CA 2628343
Sputtering targets and sputtering methods for depositing a film that includes tin and niobium. Substrates bearing coatings comprising tin and niobium, for example, low-emissivity coatings including blocker films comprising tin and niobium, or solar control coatings (e.g., conductive oxide coatings) including tin and niobium methods of manufacturing sputtering targets comprising tin and niobium.
L~invention concerne des cibles de pulvérisation et des procédés de pulvérisation pour le dépôt d'un film comprenant de l~étain et du niobium. L~invention concerne également des substrats munis de revêtements comprenant de l~étain et du niobium, par exemple des revêtements de faible émissivité comprenant des films de blocage comprenant de l~étain et du niobium ou des revêtements à commande solaire (par exemple des revêtements d~oxyde conducteur) comprenant de l~étain et du niobium. L~invention concerne également des procédés de fabrication de cibles de pulvérisation comprenant de l~étain et du niobium.
Borden Ladner Gervais Llp
Cardinal Cg Company
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