Sputtering apparatus and method

Details Sputtering apparatus and method Sputtering apparatus and method

C - Chemistry, Metallurgy

23

C

204/96.08, 204/1

C23C 14/38 (2006.01) C23C 14/35 (2006.01) H01J 37/34 (2006.01)

Patent

CA 1239115

- 1 - Abstract An apparatus and method is described for the magnetron sputtering onto a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the cathode target to produce higher yield from a given cathode target.

550621

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