Sputtering apparatus including target mounting and/or control

Details Sputtering apparatus including target mounting and/or control Sputtering apparatus including target mounting and/or control

C - Chemistry, Metallurgy

23

C

C23C 14/34 (2006.01) C23C 14/56 (2006.01)

Patent

CA 2658075

A sputtering chamber to coat a substrate (15) includes at least two sputtering targets (102,103), one of the at least two targets disposed on a first side a substrate conveyor extending within the chamber, and another of the at least two targets disposed on a second side of the conveyor. The at least two targets may be independently operable, and at least one of the targets, if inactivated, may be protected by a shielding apparatus. Both of the at least two targets may be mounted to a first wall of a plurality of walls enclosing the sputtering chamber.

L'invention concerne une chambre de pulvérisation qui comprend au moins deux cibles de pulvérisation, l'une des deux cibles au moins étant disposée d'un premier côté d'un convoyeur de substrats qui s'étend dans la chambre, l'autre des deux cibles au moins étant disposée d'un deuxième côté du convoyeur. Les deux cibles au moins sont actionnables de manière indépendante, et au moins l'une d'entre elle, si elle n'est pas activée, peut être protégée par un appareil écran. Les deux cibles peuvent être montées sur une première paroi parmi une pluralité de parois qui délimitent la chambre de pulvérisation.

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