C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/35 (2006.01) H01J 25/50 (2006.01) H01J 37/34 (2006.01)
Patent
CA 2109588
2109588 9319221 PCTABS00025 A rotatable magnet configuration for use in a magnetron sputtering system for obtaining a desired sputter target erosion profile and for obtaining a sputtered film on a substrate having a desired film characteristic, such as uniformity of thickness, and a method of designing such a magnet configuration are disclosed. The disclosed design and method compensate for the discrepancy between the actual position of the magnet and the "effective" position of the magnet as measured by a static erosion profile obtained holding the magnet stationary. The method shown describes how to adjust the actual shape of the magnet to obtain a desired effective shape that will produce a predetermined erosion profile in the sputter target. In addition, the disclosure describes how to determine an optimal erosion profile to produce a sputtered film having a desired characteristic.
Novellus Systems Inc.
R. William Wray & Associates
Varian Associates Inc.
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