Sputtering chamber comprising a liner

Details Sputtering chamber comprising a liner Sputtering chamber comprising a liner

H - Electricity

01

J

H01J 37/32 (2006.01) C23C 14/56 (2006.01)

Patent

CA 2519874

A sputtering chamber comprising a liner is provided. The liner is adapted to reduce spalling of sputtered coating (overcoat) from interior surfaces of the chamber. The liner can be mounted adjacent a selected interior surface of the chamber. The liner is preferably removable. Also provided are sputtering methods wherein the present liners are used.

L'invention porte sur une chambre de pulvérisation cathodique comprenant un revêtement qui est adapté pour réduire le décollement du revêtement pulvérisé (couche de finition) des surfaces internes de la chambre. Le revêtement peut être placé adjacent à une surface interne sélectionnée de la chambre et est de préférence amovible. L'invention porte également sur des procédés de pulvérisation dans lesquels sont utilisés les revêtements de l'invention.

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