Sputtering device and method of sputtering by means of such...

H - Electricity – 01 – J

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204/96.08, 204/1

H01J 37/34 (2006.01) C23C 15/00 (1980.01)

Patent

CA 1081656

ABSTRACT: When in a sputtering device which comprises in an envelope a cathode which at its surface consists of the material to be sputtered, a magnet device for generating one or more magnetic fields by which at least one electron trap before the surface of the cathode is determined, and an anode, said electron traps can be moved along the cathode surface, it is possible by a continuous or periodic movement of said electron traps to sputter the cathode very re- gularly so that the cathode material is used very efficiently.

281665

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