Sputtering method and apparatus with optical monitoring

Details Sputtering method and apparatus with optical monitoring Sputtering method and apparatus with optical monitoring

C - Chemistry, Metallurgy

23

C

C23C 14/52 (2006.01) C23C 14/34 (2006.01) C23C 14/35 (2006.01) C23C 14/54 (2006.01) H01J 37/32 (2006.01)

Patent

CA 2254650

In a method of sputtering thin films onto a substrate, the substrate is placed below a sputtering source assembly in a vacuum chamber. A light beam is projected onto the substrate and passes through an optical passage in the sputtering source assembly. In this way, the growth of the sputtered film can be accurately monitored at near normal angles of incidence.

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