Sputtering target fabrication method

Details Sputtering target fabrication method Sputtering target fabrication method

B - Operations, Transporting

22

F

18/1119

B22F 3/02 (2006.01) B22F 5/10 (2006.01) B22F 7/08 (2006.01) C23C 14/34 (2006.01)

Patent

CA 1112015

SPUTTERING TARGET FABRICATION METHOD ABSTRACT OF THE DISCLOSURE A method for producing a cooled sputtering target assembly is described. The resultant target is also described. The material to be sputtered is provided in the form of powder which is hot isostatically pressed in a toroidal metallic container under conditions which promote compaction and bonding of the powder particles to form a fully dense material. The container is then partially removed from the target material except for a remnant around the outer surface. A cooling jacket is then fabricated and attached to the remnant of the container.

316466

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