C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/31 (2006.01) C23C 18/42 (2006.01) C23C 18/44 (2006.01)
Patent
CA 2591411
Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties . The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents .
La présente invention concerne un procédé de dépôt autocatalytique de métal sur un substrat utilisant un bain à une température supérieure au point de trouble, de façon à avoir au moins deux phases dans le bain. L'invention concerne également un bain de dépôt autocatalytique pour l'argent métallique. L'invention concerne en outre un procédé de dépôt autocatalytique d'argent métallique directement sur une surface de silicium sans couche métallique intermédiaire. Les dépôts d'argent obtenus sont uniformes, non poreux et présentent des propriétés électriques. Ce procédé est applicable à divers traitements et formulations de bains, c'est à dire avec différents métaux, agents complexants et agents réducteurs.
Mccarthy Tetrault Llp
Polymer Kompositer I. Goeteborg Ab
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