C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 5/24 (2006.01) G03F 7/20 (2006.01) H01L 21/288 (2006.01) H05K 3/10 (2006.01) H05K 3/12 (2006.01) C01G 1/00 (2006.01) C01G 5/00 (2006.01)
Patent
CA 2648539
A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180 °C to form conductive features on the substrate.
Li Yuning
Liu Ping
Mahabadi Hadi K.
Pan Hualong
Smith Paul F.
Sim & Mcburney
Xerox Corporation
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