Stabilized polyamide compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 77/00 (2006.01) C08K 5/00 (2006.01) C08K 5/3472 (2006.01) C08K 5/3475 (2006.01) C08K 5/56 (2006.01)

Patent

CA 2114751

STABILIZED POLYAMIDE COMPOSITIONS Abstract of the Invention Polymer compositions which are described comprise (A) at least one polyamide and (B) the reaction product of (13-i) at least one copper salt and (B-ii) at least one organic metal complexing agent selected from the group consisting of N-monoacylhydrazine derivatives, N,N'-diacylhydrazine derivatives, tetrazole derivatives, and oxalic acid derivatives. These reaction products show an ability to stabilize polyamides against radiation damage and thermal degradation.

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