Stabilized thermoplastic partly aromatic polyamide molding...

Details Stabilized thermoplastic partly aromatic polyamide molding... Stabilized thermoplastic partly aromatic polyamide molding...

C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) C08G 69/26 (2006.01) C08G 69/36 (2006.01) C08K 3/32 (2006.01) C08K 5/18 (2006.01) C08L 77/00 (2006.01)

Patent

CA 2066106

O.Z. 0050/42361 Abstract of the Disclosure: Thermoplastic molding com- positions contain A) 40-99.9 % by weight of a partly aromatic and partly crystalline copolyamide having a triamine content of less than 0.5 % by weight composed of (A1) 20-90 % by weight of units derived from tereph- thalic acid and hexamethylenediamine, (A2) 0-50 % by weight of units derived from ?- caprolactam, (A3) 0-80 % by weight of units derived from adipic acid and hexamethylenediamine, (A4) 0-40 % by weight of further polyamide-forming monomers, the proportion of component (A2) or (A3) or (A4) or a mixture thereof being not less than 10 % by weight, B) 0.1-2 % by weight of at least one aromatic secondary amine, and C) 100-2000 ppm of at least one phosphorus-containing inorganic acid or a derivative thereof, the proportion of component C) being based on the total amount of components A) and B), and also D) 0-59.9 % by weight of a fibrous or particulate filler or a mixture thereof, E) 0-30 % by weight of an elastomeric polymer.

Affiliated with

Also associated with

Rating

Stabilized thermoplastic partly aromatic polyamide molding... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stabilized thermoplastic partly aromatic polyamide molding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilized thermoplastic partly aromatic polyamide molding... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1445252