C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
96/262, 96/268,
C23C 18/16 (2006.01) G03C 5/58 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1122462
Abstract of the Disclosure This invention relates to a method for depositing a metal in a selected pattern on a surface, which comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The improvement resides in treating the catalytic real image with a stabilizer solution comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.
315654
Kirby Eades Gale Baker
Western Electric Company Incorporated
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