Stabilizing mixture for a chemical copper plating bath

Details Stabilizing mixture for a chemical copper plating bath Stabilizing mixture for a chemical copper plating bath

C - Chemistry, Metallurgy

23

C

6/4

C23C 18/40 (2006.01)

Patent

CA 1188056

A B S T R A C T An aqueous solution for electroless autocata- lytic copper plating, containing a source of cupric ions, a source of hydroxylic ions, a reducing agent and a complexing agent in such a quantity as to render soluble the cupric ions in an alka- line medium, which further contains a stabilizing mixture formed by allylthiourea, at least a fer- rocyanide of alkali metal or of ammonium ion, and at least an octylphenylether of ethylene polyoxide with 9 - 10 moles of ethylene oxide for each mole of octylphenol, the said three stabilizing compounds exerting a synergical action. This solution shows a very good stability and produces copper deposits having clear and brilliant appearance and good ductility properties.

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