Stable, ionomeric photoresist emulsion and process of...

G - Physics – 03 – F

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G03F 7/027 (2006.01) G03F 7/004 (2006.01) G03F 7/033 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2185028

Disclosed are waterborne, stable photoresist compositions and methods of their preparation and use. The compositions are characterized by increased shear and storage stability. The photoresist composition comprises an aqueous emulsion of a 22 % or less neutralized carboxylated resin and non-ionic surfactant containing poly(ethylene-oxide) segments, photopolymerizable monomer and photoinitiator. Neutralization is accomplished using either an organic or an inorganic base or mixtures thereof. The photoresist compositions are useful to selectively coat and protect surfaces subjected to corrosive environments, e.g., etchant processes, in the production of circuit traces for electronic circuit boards.

L'invention concerne des compositions de photorésist stables en phase aqueuse, leur procédé de préparation ainsi que leur utilisation. Ces compositions se caractérisent par une stabilité au cisaillement et au stockage accrue. Ladite composition de photorésist se compose d'une émulsion aqueuse constituée d'au plus 22 % de résine carboxylée neutralisée et d'agent tensioactif non ionique contenant des segments de poly(éthylène-oxyde), d'un monomère photopolymérisable et d'un photoamorceur. La neutralisation s'effectue au moyen d'une base organique ou non, ou de mélanges de ces dernières. Ces composition de photorésist sont utiles pour enduire et protéger sélectivement des surfaces exposées à des environnements corrosifs, par exemple lors de la mise en oeuvre de procédés d'attaque, dans la production de pistes conductrices pour cartes de circuits imprimés.

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