Stacked circuit board assembly adapted for heat dissipation

Details Stacked circuit board assembly adapted for heat dissipation Stacked circuit board assembly adapted for heat dissipation

H - Electricity

05

K

H05K 7/20 (2006.01) H05K 1/14 (2006.01)

Patent

CA 2348507

An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

L'invention concerne un appareil permettant de dissiper la chaleur d'un ensemble cartes à circuit imprimé superposées. L'appareil comprend des cartes à circuit imprimé orientées sur des plans espacés qui sont sensiblement parallèles les uns aux autres. Un système de transfert de chaleur, connecté aux cartes à circuit imprimé, transfère la chaleur entre les cartes à circuit ; un système de dissipation thermique connecté à au moins une carte à circuit dissipe une partie au moins de la chaleur transférée.

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