Static dissipative resin composition

H - Electricity – 05 – F

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H05F 1/00 (2006.01) C08K 3/00 (2006.01) C08K 7/08 (2006.01) H01B 1/20 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01)

Patent

CA 2062264

A static dissipative resin composition has semiconductor fillers dispersed in the resin with at least some of the fillers in electrical contact with each other to form a conductive path. The .alpha. value representing the degree of nonlinearity of the V-i characteristic at the contact between the semiconductor fillers should be 2-150, and the volume resistivity of the semiconductor filler is desirably 105-1010.OMEGA..cm, whereby, by employment of a conductive filler or a solid lubricant together with the semiconductor filler, various physical properties of the resin composition are improved.

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