Stencil for use in the application of a viscous substance to...

Details Stencil for use in the application of a viscous substance to... Stencil for use in the application of a viscous substance to...

H - Electricity

05

K

H05K 3/00 (2006.01) B41C 1/14 (2006.01) H05K 3/12 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2090579

STENCIL FOR USE IN THE APPLICATION OF A VISCOUS SUBSTANCE TO A PRINTED CIRCUIT BOARD OR THE LIKE Abstract of the Disclosure A sheet of polymer material is used as a stencilling material in the application of a viscous substance such as solder paste or an adhesive substance to a printed circuit board. The sheet of polymer material is stretched to a uniform tension and is stabilized by mounting it to a rigid frame. Openings are cut into the film in a desired pattern to allow passage of the viscous substance to the printed circuit board. - i -

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