Stepped multilayer interconnection apparatus and method of...

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 1/02 (2006.01) H05K 3/32 (2006.01) H05K 3/36 (2006.01) H05K 1/11 (2006.01) H05K 1/14 (2006.01)

Patent

CA 2073911

A stepped multilayer Printed Wiring Board (PWB) (10), having an increased numberof wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (121, 122, 123...12n) to provide the lowestnumber of wiring paths required anywhere on the board. In regions where a largernumber of wiring paths are required, a secondary, multilayer PWB section (22), having a sufficient number of layers (221, 222, 223) to provide the required additional number of wiring paths, is connected to the main PWB by a layer of anisotropically conductive material (30) sandwiched therebetween. A plurality ofmechanical fasteners (33,33'), typically bifurcated or heat-staked plastic pins,extends through the secondary PWB section and the main PWB to hold one to the other.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Stepped multilayer interconnection apparatus and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stepped multilayer interconnection apparatus and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stepped multilayer interconnection apparatus and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1604740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.