Storage-stable heat-curable mixtures and the use thereof

Details Storage-stable heat-curable mixtures and the use thereof Storage-stable heat-curable mixtures and the use thereof

C - Chemistry, Metallurgy

08

F

400/5806

C08F 299/02 (2006.01) C08G 73/12 (2006.01) C09D 101/08 (2006.01) C09D 179/08 (2006.01)

Patent

CA 1284396

Storage-stable heat-curable mixtures and the use thereof Abstract of the Disclosure Storage-stable heat-curable mixtures are described which contain A) a polyimide which contains in the molecule at least two radicals of formula I Image (I) wherein D is a divalent radical with a C=C double bond, B) an alkenylphenol, C) an epoxide group-free adduct of an epoxy resin with excess alkenylphenol or D) a polyimide which is soluble in organic solvents or a mixture of C) and D). These mixtures are employed for example as laminating resins or electro-resins, as adhesives or adhesive films for application at high temperatures, or for the preparation of coatings.

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