Storage-stable moulding powder based on epoxy resins

C - Chemistry – Metallurgy – 09 – D

Patent

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C09D 5/03 (2006.01) C08G 59/18 (2006.01) C09D 163/00 (2006.01)

Patent

CA 2242928

A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60 ~C, b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60 ~C and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 µm, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.

Cette invention concerne une poudre à mouler que l'on peut polymériser par application de chaleur ou de pression. Cette poudre à mouler contient un mélange mécanique composé (a) d'un composé époxy pulvérisé contenant en moyenne plus qu'un groupe époxy dans sa molécule et ayant un point de ramollissement supérieur à 60 ·C, (b) d'une amine aliphatique ou N-hétérocyclique pulvérisée ou d'un produit d'addition contenant un groupe amino pulvérisé ayant comme base une amine aliphatique, cycloaliphatique, araliphatique ou N-hétérocyclique contenant en moyenne plus d'un groupe amino dans sa molécule et ayant un point de fusion ou un point de ramollissement supérieur à 60 ·C et, éventuellement, (c) d'additifs traditionnellement conçus pour les poudres à mouler, les particules des composés (a) et (b) étant de dimension inférieure à 200 µm. Ladite poudre à mouler convient parfaitement à la préparation de revêtements de substrats thermosensibles et elle est particulièrement utile au procédé de poudrage.

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