Storage stable polyimide-forming solutions for adhesives

C - Chemistry – Metallurgy – 08 – L

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117/196, 400/770

C08L 35/00 (2006.01) B01J 13/00 (2006.01) B32B 15/14 (2006.01) C08G 73/12 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1078544

Abstract of the Disclosure The invention relates to solutions which are stable on storage and which contain curable mixtures of polymaleimides, comonomers for these polymaleimides and, optionally, polymeri- sation catalysts and compounds which contain at least one furyl radical, preferably furfuryl alcohol. The solu- tions are used for the manufacture of crosslinked polymers containing imide groups. Usually a substrate is impreg- nated with the solution. After drying, curing is carried out at 100 to 300°C. Using a known method, for example, glass fibre fabric is subjected to hot pressing together with a copper foil, curing being effected. This gives corres- pondingly copper-coated laminated sheets which are outstand- ingly suitable for the manufacture of printed circuits.

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