Strain isolated integrated optic chip package

Details Strain isolated integrated optic chip package Strain isolated integrated optic chip package

G - Physics

02

B

G02B 6/12 (2006.01) G02B 6/30 (2006.01) G02B 7/00 (2006.01)

Patent

CA 2120700

2120700 9307519 PCTABS00021 A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.

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