Stripline shielding techniques in low temperature co-fired...

Details Stripline shielding techniques in low temperature co-fired... Stripline shielding techniques in low temperature co-fired...

H - Electricity

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H01L 23/60 (2006.01) H01L 27/00 (2006.01) H01P 3/08 (2006.01) H05F 3/02 (2006.01) H05K 1/02 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 1/16 (2006.01)

Patent

CA 2063121

STRIPLINE SHIELDING TECHNIQUES IN LOW TEMPERATURE CO-FIRED CERAMIC ABSTRACT OF THE DISCLOSURE Stripline shielding structures for stripline conduc- tors implemented in unitized multilayer circuit structures are disclosed. The stripline structures generally include a lower ground plane below the stripline conductor, one or more embedded ground planes above the stripline conductor, and conductive elements laterally spaced from the stripline conductor for electrically connecting the ground planes. Resistive layers may be included above the embedded ground plane(s) for additional shielding.

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