Stripped gold plating process

Details Stripped gold plating process Stripped gold plating process

C - Chemistry, Metallurgy

04

B

117/64

C04B 41/90 (2006.01) B23K 20/233 (2006.01) B23K 35/00 (2006.01) C04B 41/52 (2006.01) C04B 41/89 (2006.01) H01L 21/48 (2006.01) H01R 43/16 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1232497

Stripped Gold Plating Process Abstract A method for fabricating metallurgical contacts is disclosed for making thermocompression bonds to a metallized ceramic substrate on which semiconductor chips are to be mounted and electrically contacted. The method comprises placing a nickel layer on the metallized portion of the substrate and then covering the nickel with an immersion layer of gold. The gold immersion layer is selectively removed from locations where thermocompression-bonded contacts are desired. Removal is accomplished by applying a chemical strip- per. Heavy gold is electroplated on said locations and the assemblage is heat treated prior to placement of the thermocompression-bonded contacts.

500847

Affiliated with

Also associated with

Rating

Stripped gold plating process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stripped gold plating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stripped gold plating process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1225563