Stripping composition for thermoset resins

Details Stripping composition for thermoset resins Stripping composition for thermoset resins

C - Chemistry, Metallurgy

09

K

149/26, 149/5

C09K 13/00 (2006.01) C11D 7/22 (2006.01) H02K 15/00 (2006.01)

Patent

CA 1068199

STRIPPING COMPOSITION FOR THERMOSET RESINS AND METHOD OF REPAIRING ELECTRICAL APPARATUS ABSTRACT OF THE DISCLOSURE A stripper composition for thermoset resins is disclosed which comprises about 1 to about 99% of an aro- matic compound which has a boiling point over 180°C and is a phenol or a primary or secondary amine, and about 1 to about 99% of a carboxylic acid compound which has a boiling point over 180°C and is a rosin acid or a mono- or di-carboxylic fatty acid or an ester thereof. The composition also pre- ferably includes sufficient hydrogen bonding compound to react with any acid present in the composition plus about 20 to about 50% in excess of that amount. A swelling agent is also preferably included.

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