Structural adhesive composition having high temperature...

Details Structural adhesive composition having high temperature... Structural adhesive composition having high temperature...

C - Chemistry, Metallurgy

09

J

C09J 163/00 (2006.01) C08G 59/56 (2006.01) C08G 59/62 (2006.01) C09J 121/00 (2006.01)

Patent

CA 2102138

A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210°C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature a conditions.

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