C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
400/5902
C08G 59/12 (2006.01) C08G 59/38 (2006.01) C09J 163/00 (2006.01)
Patent
CA 1298012
ABSTRACT OF THE DISCLOSURE A process for preparing an epoxy resin and a process for preparing a hardened and cured epoxy resin adhesive is provided, together with the epoxy resins and adhesives made thereby. The epoxy resin is prepared by mixing together about 76 parts per hundred of a novolac epoxy resin, about 19 parts per hundred of a bisphenol F epoxy resin, and about 5 parts per hundred of carboxy-terminated butadiene acrilonitrile, heating the mixture to a temperature of from about 290 to about 350 degrees Fahrenheit for a time of from about two to about three hours, and then cooling. An epoxy adhesive is prepared by mixing 100 parts of the material so prepared with about parts of a curing agent consisting essentially of diethyltriamine. The resulting adhesive mixture has a paste-like consistency that is easily applied and cured at ambient temperature. The shear strength of the cured adhesive is about 4000 psi at ambient temperature and about 2000 psi at 250 degrees Fahrenheit. The cured adhesive has excellent peel strength, indicating ductility and toughness. It also exhibits acceptably low levels of particle outgassing, permitting its use in spacecraft applications.
534512
Domnikov Larissa
Garcia Gilbert
Hughes Aircraft Company
Sim & Mcburney
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