Structural material and its application

B - Operations – Transporting – 29 – C

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18/1216

B29C 67/00 (2006.01) B29C 61/06 (2006.01) B29C 63/00 (2006.01) B29C 65/50 (2006.01) B29C 65/66 (2006.01)

Patent

CA 2002408

ABSTRACT OF DISCLOSURE Memory-shaped molded objects which can be deformed by application of heat and/or force and then restored to their original condition by heating above their restoration or memory temperature. The molded objects can have on at least a portion of their surface a resilient layer made from an elastomeric material and an adhesive affixing said objects to structural members for the purpose of retaining, connecting, or sealing. 2195/1a

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