Structure and method for aligning a substrate with respect...

Details Structure and method for aligning a substrate with respect... Structure and method for aligning a substrate with respect...

B - Operations, Transporting

41

J

B41J 2/14 (2006.01) B41J 2/16 (2006.01)

Patent

CA 2084344

In a printhead according to the preferred embodiment of the invention, a polymer tape having orifices formed therein and containing conductive traces is provided with one or more windows exposing ends of the conductive traces. A separate substrate contains heating elements and electrodes. A conventional, commercially available automatic inner lead bonder is then used to automatically align the orifices to the heating elements. The automatic alignment of the orifices and heating elements also inherently aligns the electrodes on the substrate with the exposed ends of the traces. The wire bonder is then used to bond the traces to the associated substrate electrodes through the window.

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