B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 1/20 (2006.01) B23K 1/00 (2006.01) B23K 1/002 (2006.01) B23K 1/18 (2006.01) B23K 1/19 (2006.01) B23K 35/00 (2006.01) B60K 15/03 (2006.01) C23C 2/08 (2006.01) C25D 5/26 (2006.01) B23K 35/26 (2006.01)
Patent
CA 2341725
Sn-Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn-Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved.
L'invention concerne une structure d'assemblage pour éléments métalliques permettant d'assembler un premier élément métallique et un second élément métallique par brasage. Cette structure est caractérisée en ce que l'un aux moins desdits éléments métalliques est revêtu d'un alliage SnZn, et en ce que l'on utilise un alliage SnAg comme brasure, ce qui permet d'empêcher la détérioration par la chaleur de la brasure et la corrosion par contact mutuel des revêtements, et d'améliorer non seulement l'étalement de la brasure, mais aussi la résistance à la corrosion et des qualités, notamment la résistance de joint, de la structure d'assemblage.
Narita Masayuki
Takikawa Kazunori
Honda Giken Kogyo Kabushiki Kaisha
Marks & Clerk
Yachiyo Kogyo Kabushiki Kaisha
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