Structure and method for the fabrication of lpmcm...

Details Structure and method for the fabrication of lpmcm... Structure and method for the fabrication of lpmcm...

H - Electricity

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H01L 25/00 (2006.01) H01L 21/98 (2006.01) H01L 23/32 (2006.01) H01L 23/40 (2006.01) H01L 25/07 (2006.01)

Patent

CA 2045945

A heat-conductive honeycomb ceramic spacer having an array of apertures therein for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet. Use of such a foil also allows disconnection of defective stacks in the device which includes extra stacks to compensate therefore, according to an n - x design philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.

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