H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/18 (2006.01) H05K 7/14 (2006.01)
Patent
CA 2050263
A package holding structure comprises a pair of linear guide members (11), secured on the package (2) along the respective edges thereof opposite to each other, and a pair of support members (10) for receiving the respective guide members (11), secured at one end thereof on the backboard (3) in a cantilever manner while projected vertically therefrom and having a connector housing (15) at the base end thereof for receiving a connector (14) on the package. The housing (15) has positioning apertures (13) to be fitted to contact pins (12) projected from the backboard (3).
Kanno Takashi
Takahashi Tsutomu
Zenitani Hideki
Fujitsu Limited
Mcfadden Fincham
LandOfFree
Structures for holding packages on backboard of electronics... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structures for holding packages on backboard of electronics..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structures for holding packages on backboard of electronics... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2035443