Subassembly for optoelectronic devices

Details Subassembly for optoelectronic devices Subassembly for optoelectronic devices

G - Physics

02

B

345/62

G02B 6/42 (2006.01)

Patent

CA 1311042

SUBASSEMBLY FOR OPTOELECTRONIC DEVICES Abstract A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to bereliably and inexpensively mounted on the base and coupled to the fiber.

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