Substrate adhesion enhancement to film

Details Substrate adhesion enhancement to film Substrate adhesion enhancement to film

H - Electricity

05

K

H05K 3/38 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2445604

The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.

L'invention concerne un procédé de fabrication de cartes de circuits imprimés présentant une adhérence intermédiaire améliorée. Plus particulièrement, l'invention concerne des cartes de circuits imprimés exemptes d'adhésif présentant une excellente propriété thermique, lesquelles cartes peuvent être utilisées pour produire des circuits haute densité. Une feuille de métal est laminée sur une surface gravée d'un substrat en polyimide sur lequel est déposé un film en polyimide. La gravure de la surface du substrat permet l'adhérence résistante d'un film en polyimide pur sur le substrat.

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