Substrate loading apparatus

H - Electricity – 01 – L

Patent

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Details

H01L 21/68 (2006.01) H01L 21/687 (2006.01) H01L 49/02 (2006.01)

Patent

CA 2364995

The present invention provides apparatus for loading a substrate (65) onto a processing surface (61) in a thin- film processing chamber (60). The apparatus includes a support (66) which cooperates with one or more corresponding apertures (62) in the processing surface so as to be movable between an extended position in which the support can support a substrate (65) above the processing surface (61) , and a retracted position in which the support is flush with or located below the processing surface (61). The support has a number of limbs (64) which extend radially outwardly from a central hub, at an angle relative to the processing surface. The limbs contact the edges of different sized substrates in use so as to support the substrate in a support plane above the central hub and substantially parallel to the processing surface.

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