Substrate transfer device for thin-film deposition apparatus

Details Substrate transfer device for thin-film deposition apparatus Substrate transfer device for thin-film deposition apparatus

H - Electricity

01

L

H01L 21/205 (2006.01) C23C 16/44 (2006.01) H01L 21/68 (2006.01) H01L 31/04 (2006.01)

Patent

CA 2524482

Disclosed is a substrate transfer device for a thinfilm deposition apparatus. In order to positively prevent plasma generated by electrodes (3) from coming into a rear surface of the substrate (4) and to attain cost reduction and improvement in maintenance without providing a mask panel (35) in a deposition chamber (1) with which the whole outer peripheral edge of the substrates (4) is masked, partition panels (37) each with an opening (36) larger than substrate (4) and facing the electrode (3) are arranged on a transfer carriage (23), a picture-frame-like substrate holder (38) with the substrate (4) fitted thereto being arranged on a side of the partition panel away from the electrode (3) such that the substrate (4) is arranged substantially at a center of the opening (36) of the partition panel (37) and the outer peripheral edge of the substrate holder (38) is masked with the partition panel (37).

Selon cette invention, il convient d'empêcher de façon fiable que le plasma produit par une électrode n'entre dans l'espace situé derrière la partie arrière d'un substrat (4), même lorsqu'un grand panneau de masque (35) recouvrant entièrement le bord du substrat (4) n'est pas installé dans une chambre de formation de couches (1).Un dispositif de transfert de substrat d'un appareil de formation de couches minces est structuré comme suit : un panneau de séparation (37) comportant une ouverture (36) plus grande que le substrat (4) et situé à l'opposé d'une électrode couplée de manière diélectrique (3) est placé verticalement sur un chariot de transfert (23) ; un porte-substrat (38) auquel le substrat (4) est fixé est placé sur le côté opposé du panneau de séparation (37) opposé à l'électrode couplée de manière diélectrique (3). Le substrat (4) est déposé sensiblement au centre de l'ouverture (36). Le bord du porte-substrat (38) est recouvert du panneau de séparation (37).

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