H - Electricity – 01 – J
Patent
H - Electricity
01
J
204/96.08, 204/9
H01J 37/32 (2006.01) C23C 16/04 (2006.01) C23C 16/511 (2006.01) C23F 4/00 (2006.01) H05H 1/46 (2006.01)
Patent
CA 1336180
An apparatus for treating a substrate is provided which comprises a chamber for encasing the substrate and provided with a microwave-introducing section, and a means for generating plasma within the chamber to treat the substrate by the plasma. In the apparatus the means for generating plasma is provided to generate plasma in the vicinity of the substrate and in a spatial zone sufficiently small as compared with the size of said chamber.
562510
Den Tohru
Ohmi Kazuaki
Sugata Masao
Tsuda Hisanori
Yokono Kohjiro
Canon Kabushiki Kaisha
Ridout & Maybee Llp
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