Substrateless thermoelectric device and method of making same

Details Substrateless thermoelectric device and method of making same Substrateless thermoelectric device and method of making same

H - Electricity

01

L

356/96, 322/1.5

H01L 35/28 (2006.01) H01L 35/32 (2006.01) H01L 35/34 (2006.01)

Patent

CA 1200612

ABSTRACT A new and improved thermoelectric device of the type which provides electrical energy in re- sponse to a temperature gradient applied across the device exhibits both structural integrity and improved efficiency. The new thermoelectric de- vice includes a plurality of thermoelectric ele- ments, coupling means on opposite respective sides of the thermoelectric elements for interconnecting the elements electrically in accordance with a predetermined pattern, and encapsulant means in- cluding an encapsulant material covering the ex- posed surfaces of the thermoelectric elements. The encapsulant forms void spaces between the ele- ments for providing effective thermal insulation between the elements and confining substantially all of the heat flow from the temperature gradient to and through the elements. The coupling means include electrically conductive plate segments for electrically interconnecting the thermoelectric elements. The plate segments are joined to the elements on respective opposite sides thereof and are contacted and held in fixed relative relation by the encapsulant material. The plate segments further define an outer periphery of the device and the encapsulant material bridge across the plate segments at the periphery of the device. As a result, structural device integrity is obtained while more efficient use of the temperature gra- dient is made.

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