Superconducting circuit fabrication

Details Superconducting circuit fabrication Superconducting circuit fabrication

H - Electricity

01

L

356/178, 352/49

H01L 39/02 (2006.01) C25D 11/02 (2006.01) H01L 39/24 (2006.01)

Patent

CA 1183282

Abstract of the Disclosure An improved method of anodization of this films and the fabrication of superconducting devices using the improved method. An electrically conducting contact layer is formed over a substrate between an electrically conducting object layer and the substrate. Also, an electrically insulating layer is formed between the object layer and the contact layer. The contact layer is connected to a power supply and at least a preselected portion of the object layer is anodized to a predetermined thickness. This may include anodizing all of some preselected portions through the complete thickness of the object layer. The preselected portions are identified by providing a pattern of hardened photoresist in the object layer. The preselected portions are those portions not protected by the pattern. When anodization of the electrically conducting object layer takes place, the resulting anodized portion is thicker than the thickness of the portion of the object layer that it replaces. The present invention further includes reducing the preselected portion of the object layer to be anodized by a predetermined amount before anodizing so that when anodization is complete, the resulting partially anodized partially conducting object layer is substantially planar. Alternative- ly, the thickness of the anodized preselected portions can be reduced after anodizing by a predetermining amount to cause the partially anodized, partially conducting layer to be substantially planar. The same pattern of hardened photoresist can be used when reducing the thickness of portions of the object layer or anodized preselected portions.

413821

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