Supercritical fluid-based cleaning compositions and methods

Details Supercritical fluid-based cleaning compositions and methods Supercritical fluid-based cleaning compositions and methods

B - Operations, Transporting

08

B

B08B 3/00 (2006.01) B08B 3/04 (2006.01) D06L 1/00 (2006.01)

Patent

CA 2565231

Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one ~-diketone.

L'invention concerne des compositions et des procédés utilisant des fluides supercritiques, par exemple du dioxyde de carbone supercritique, pour le retrait de matériau indésirable de structures de dispositif micro-électronique et d'équipement de traitement. Une composition de ce type, servant à ôter des films de surface de flux et de brasure, comprend un fluide supercritique, par exemple du CO2 supercritique, et un co-solvant organique, par exemple du xylène. Une autre composition de ce type servant à ôter des métaux, des oxydes métalliques, des résidus après gravure contenant des métaux et des particules CMP de substrats à semi-conducteurs, comprend un fluide supercritique et au moins une ß-dicétone.

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