Support acting as a heat sink for printed circuit boards

Details Support acting as a heat sink for printed circuit boards Support acting as a heat sink for printed circuit boards

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) H05K 1/05 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1287185

PRÉCIS DE LA DIVULGATION: Un support formant drain thermique pour les cartes de circuits imprimés, comprend une âme en graphite orientée par compression pour obtenir une très forte conductivité thermique latérale et une densité relativement faible. Cette âme est maintenue par deux peaux extérieures formées de plis de fibres de carbone noyées dans une matrice en résine époxy. Un cadre métallique réalisé en invar vient rigidifier le support, ce qui permet d'obtenir des supports conduisant très bien la chaleur tout en étant légers.

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