Support assembly for integrated circuits

Details Support assembly for integrated circuits Support assembly for integrated circuits

H - Electricity

01

L

356/143

H01L 23/48 (2006.01) H01L 23/28 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1272306

SUPPORT ASSEMBLY FOR INTEGRATED CIRCUITS V. K. Sahakian Jon Long ABSTRACT A composite support assembly for an integrated circuit chip includes a rigid lead frame that is attached to a relatively thin flexible tape-like structure. The tape-like structure is etched with inner lead fingers and outer lead fingers to allow a short pitch, high density arrangement of the lead fingers, thereby enabling bond wires that connect an IC chip to the support assembly to be shortened. As a result, a significant increase in the number of leads is realized, using a standard size IC package.

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