Support-package for semiconductor power chip for immersion...

Details Support-package for semiconductor power chip for immersion... Support-package for semiconductor power chip for immersion...

H - Electricity

01

L

356/110

H01L 21/00 (2006.01)

Patent

CA 1118908

ABREGE DESCRIPTIF Boïtier-support d'une pastille semiconductrice permettant le centrage de celle-ci entre les deux blocs d'anode et de cathode. Il comprend deux plaquettes isolantes polygonales prenant appui sur chacun des blocs et munies d'encoches à 120° l'une de l'autre dans lesquelles sont encliquetés des axes isolants. Dans le cas d'un thyristor, un fil souple isolé est relié à un plot terminé par une forme sphérique en contact avec la gâchette du thyristor grâce à un ressort en spirale. Application au domaine ferroviaire.

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