Surface activated adhesive systems

Details Surface activated adhesive systems Surface activated adhesive systems

C - Chemistry, Metallurgy

09

J

C09J 5/02 (2006.01) C09J 4/00 (2006.01)

Patent

CA 2581066

Methods for adhesive bonding are disclosed. The methods includes contacting a substrate with an activator composition which includes a reactive solvent, such as methyl ethyl ketone or acrylic-based monomers, and a reducing agent, such that the treated substrate has a working time of greater than about four weeks, and contacting the substrate with adhesive compositions to result in adhesive bonding.

La présente invention concerne des procédés de fixation par adhésif. Les procédés consistent à mettre en contact un substrat avec une composition d'activation qui renferme un solvant réactif, tel que des monomères à base de méthyléthylcétone ou d'acrylique, et un agent réducteur, de sorte que le substrat traité ait un temps de travail supérieur à environ quatre semaines, puis à mettre en contact le substrat avec des compositions adhésives pour effectuer la fixation par adhésif.

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