Surface mounted circuits including hybrid circuits, having...

Details Surface mounted circuits including hybrid circuits, having... Surface mounted circuits including hybrid circuits, having...

H - Electricity

05

K

356/7

H05K 1/02 (2006.01) C23C 16/02 (2006.01) H01L 21/48 (2006.01) H01L 25/16 (2006.01) H05K 3/10 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1242810

ABSTRACT OF THE DISCLOSURE A surface mounted circuit is disclosed. The circuit includes an insulating substrate, a chemical vapor deposited interconnect layer of an electrically conductive metal, as Cr, Fe, Co, Ni, W, Mo, Mn or mixtures thereof, and at least one circuit element. Optionally the surface mounted circuit includes an interfacial layer of W, Mo, Mn, or a mixtures thereof, chemical vapor deposition of an interconnect layer of Cr, Fe, Ni, Co, Mn, W, Mo, or mixtures thereof, and bonding of a circuit element atop the interconnect layer. Also disclosed is a support, adapted for use as a circuit board for a surface mounted circuit.

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