Surface-mounted fuse device

H - Electricity – 01 – H

Patent

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Details

H01H 85/041 (2006.01) H01C 7/00 (2006.01) H01C 7/10 (2006.01) H01C 7/12 (2006.01) H01C 17/08 (2006.01) H01H 69/02 (2006.01) H01H 85/046 (2006.01) H01H 85/11 (2006.01)

Patent

CA 2191346

A thin film surface-mount fuse (58) having two material subassemblies. The first subassembly in- cludes a fusible link (42), its supporting substrate (13) and terminal pads (34, 36). The second subassem- bly includes a protective layer (56) which overlies the fusible link (42) so as to provide protection from impacts and oxidation. The protective layer (56) is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhe- sive. In addition, the most preferred supporting sub- strate (13) is an FR-4 epoxy or a polyimide.

Un fusible à couche mince monté en surface (58) possède deux sous-ensembles matière. Le premier sous-ensemble comprend une liaison fusible (42), son substrat (13) et les régions terminales (34, 36). Le deuxième sous-ensemble comprend une couche protectrice (56) qui recouvre la liaison fusible (42) de manière à assurer une protection contre les chocs et l'oxydation. La couche protectrice (56) est de préférence constituée d'un matériau polymère. Le matériau polymère idéal est un adhésif au polycarbonate. En outre, le substrat (13) idéal est un époxy FR-4 ou un polyimide.

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